NovoLINC Redefines
Thermal Management

The ever-increasing power of electronic chipsets generate enormous heat. Without effective cooling, performance and reliability suffers. While thermal demands continue to rise exponentially, traditional thermal interface solutions have not kept pace – making them a critical bottleneck in heat dissipation.

NovoLINC directly addresses these challenges with our novel nanocomposite technology that reduce thermal resistance to an industry-record low.

NovoLINC ensures high-performance, high-power systems achieve their utmost performance.